Nicholas Erickson

Ph.D. student

Thesis
  • Topic: Particle Simulations for Through-Silicon-Vias (TSVs)
  • Advisor: Dr. Jun Fan
  • Estimated Graduation Date: February 2019
Projects at Missouri S&T
  • Flex Cable Modeling
  • De-embedding Techniques for On-Chip Transmission Lines
  • Reducing Crosstalk Between IC Packages
  • Characterization of Ferrite Sheets
  • Particle Simulations for Semiconductor Devices
  • Reducing Conducted Emissions for TV Power Supplies
Education
  • MS CpE, Dec 2013, Missouri University of Science and Technology
  • BS CpE, May 2012, Missouri University of Science and Technology