Technical Papers Published in 2006

Index

“Detection and identification of vehicles based on their unintended electromagnetic emissions"
Dong, X.; Weng, H.; Beetner, D. G.; Hubing, T. H.; Wunsch, II, D. C.; Noll, M.; Gksu, H.; Moss, B.;
IEEE Transactions on Electromagnetic Compatibility
Volume 48,  Issue 4,  Nov. 2006 Page(s):752 - 759

“Matched filter detection and identification of electronic circuits based on their unintentional radiated emissions"
Shaik, A.; Weng, H; Dong, X; Hubing, T.H.; Beetner, D.G.;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 3,  14-18 Aug. 2006 Page(s):853 - 856

“Application of chip-level EMC in automotive product design"
Hu, K.; Weng, H.; Beetner, D.; Pommerenke, D.; Drewniak, J.; Lavery, K.; Whiles, J.
2006 IEEE Symposium on Electromagentic Compatibility
Volume 3,14-18 Aug. 2006 Page(s):842 - 848

“Predicting TEM cell measurements from near field scan data"
Weng, H; Beetner, D.G.; DuBroff, R.E.;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 3,14-18 Aug. 2006 Page(s):560 - 564

“Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements"
Kasturi, V.; Deng, S.; Hubing, T.; Beetner, D.;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 2, 14-18 Aug. 2006 Page(s):422 - 425

“An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances"
Wang, C; Mao, J; Selli, G.; Luan, S; Zhang, L;Fan, J; Pommerenke, D.J.; DuBroff, R.E.; Drewniak, J.L.;
IEEE Transactions on Advanced Packaging
Volume 29,  Issue 2,  May 2006 Page(s):320 - 334

“Numerical analysis of sandwiched composite-FSS structures"
Qiang, R; Chen, J; Huang, J; Koledintseva, M.; Dubroff, R.; Drewniak, J.; Yang, F;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 3,14-18 Aug. 2006 Page(s):742 - 746

“Crosstalk analysis for nonparallel transmission lines using PEEC with a dynamic Green's function formulation"
Cracraft, M.A.; Drewniak, J.L.;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 1, 14-18 Aug. 2006 Page(s):29 - 33.

“Signal link-path characterization up to 20 GHz based on a stripline structure"
Zhang, J; Drewniak, J.L.; Pommerenke, D.J.; DuBroff, R.E.; Yang, Z; Cheng, W; Fisher, J.; Camerlo, S.;
H. Ke and T. Hubing
2006 IEEE Symposium on Electromagentic Compatibility
Volume 2, 14-18 Aug. 2006 Page(s):356 - 361

“Analysis of noise coupling result from overlapping power areas within power delivery networks"
Feng, G; Selli, G.; Chand, K.; Lai, M; Xue, L; Drewniak, J.L.; Archambeault, B.; Connor, S.;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 2, 14-18 Aug. 2006 Page(s):304 - 309

“Influence of an extended stub at connector ports on signal launches and TRL de-embedding"
Zhang, J; Drewniak, J.L.; Pommerenke, D.J.; Yang, Z;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 1, 14-18 Aug. 2006 Page(s):172 - 177

“A method for charactering EMI coupling paths and source properties in complex systems"
Sun, S; Feng, G; Ding, C; Pommerenke, D.J.; Drewniak, J.L.;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 1, 14-18 Aug. 2006 Page(s):114 - 118

“Laser optical in-circuit measurement system for immunity applications"
Ding, C; Pommerenke, D.;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 3, 14-18 Aug. 2006 Page(s):569 - 574

“Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation"
Sun, S; Pommerenke, D.; Drewniak, J.; Xiao, K; Chen, S; Wu, T
2006 IEEE Symposium on Electromagentic Compatibility
Volume 2, 14-18 Aug. 2006 Page(s):550 - 555

“Common-mode radiation resulting from handassembled cable bundles on automotive platforms"
Sun, S; Drewniak, J.; Pommerenke, D.;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 2, 14-18 Aug. 2006 Page(s):298 - 303

Index