EMC Laboratory 
4000 Enterprise Dr. 
Missouri University of Science
and Technology
Rolla, MO 65401
emclab@mst.edu

Technical Papers Published in 2007

Index

Estimation of High-Frequency Currents From Near-Field Scan Measurements"
Haixiao Weng; Beetner, D.G.; DuBroff, R.E.; Jin Shi;
IEEE Transactions on Electromagentic Compatibility
Volume 49,  Issue 4,  Nov. 2007 Page(s):805 - 815

Characterizing the Electric Field Coupling from IC Heatsink Structures to External Cables Using TEM Cell Measurements"
Deng Shaowei; Hubing, T.; Beetner, D.G.
I
EEE Transactions on Electromagentic Compatibility
Volume 49,  Issue 4,  Nov. 2007 Page(s):785 - 791

Validation of Worst-Case and Statistical Models for an Automotive EMC Expert System"
Beetner, D.G.; Haixiao Weng; Meilin Wu; Hubing, T;
2007 IEEE Symposium on Electromagentic Compatibility
9-13 July 2007 Page(s):1 - 5

Mode Suppressed TEM Cell Design For High Frequency IC Measurements"
Shaowei Deng; Pommerenke, D.; Hubing, T.; Drewniak, J.; Beetner, D.; Dongshik Shin; Sungnam Kim; Hocheol Kwak;
2007 IEEE Symposium on Electromagentic Compatibility
9-13 July 2007 Page(s):1 - 6

Experimental Investigation of the ESD Sensitivity of an 8-Bit Microcontroller"
Lijun Han; Jayong Koo; Pommerenke, D.; Beetner, D.; Carlton, R.;
2
007 IEEE Symposium on Electromagentic Compatibility
9-13 July 2007 Page(s):1 - 6

Development and Application of a High-Resolution Thin-Film Probe"
Shaohua Li; Kuifeng Hu; Beetner, D.; Drewniak, J.; Reck, J.; O'Keefe, M.; Kai Wang; Xiaopeng Dong; Slattery, K.;
2007 IEEE Symposium on Electromagentic Compatibility
9-
13 July 2007 Page(s):1 - 5

Wave propagation on power cables with special regard to metallic screen design"
Papazyan, R.; Pettersson, P.; Pommerenke, D.;
IEEE Transactions on
Dielectrics and Electrical Insulation
Volume 14,  Issue 2,  April 2007 Page(s):409 - 416.

Adaptive Power Control Protocol With Hardware Implementation for Wireless Sensor and RFID Reader Networks"
Kainan Cha; Jagannathan, S.; Pommerenke, D.;
IEEE
Systems Journal,
Volume 1,  Issue 2,  Dec. 2007 Page(s):145 - 159 

Frequency-Domain Measurement Method for the Analysis of ESD Generators and Coupling"
Jayong Koo; Qing Cai; Muchaidze, G.; Martwick, A.; Kai Wang; Pommerenke, D.;
2006 IEEE Symposium on Electromagentic Compatibility
Volume 2, 14-18 Aug. 2006 Page(s):304 - 309

“Influence of an extended stub at connector ports on signal launches and TRL de-embedding"
Jayong Koo; Qing Cai; Muchaidze, G.; Martwick, A.; Kai Wang; Pommerenke, D.;
IEEE Transactions on
Electromagnetic Compatibility
Volume 49,  Issue 3,  Aug. 2007 Page(s):504 - 511 

Hand-Assembled Cable Bundle Modeling for Crosstalk and Common-Mode Radiation Prediction"
Shishuang Sun; Geping Liu; Drewniak, J.L.; Pommerenke, D.J.;
IEEE Transactions on Electromagnetic Compatibilit y
Volume 49,  Issue 3,  Aug. 2007 Page(s):708 - 718

A Three-Dimensional FDTD Subgridding Algorithm With Separated Temporal and Spatial Interfaces and Related Stability Analysis"
Kai Xiao; Pommerenke, D.J.; Drewniak, J.L.;
IEEE Transactions on
Antennas and Propagation
Volume 55,  Issue 7,  July 2007 Page(s):1981 - 1990 

Application and limits of IC and PCB scanning methods for immunity analysis"
Pommerenke, David; Muchaidze, Giorgi; Jayong Koo,; Qing Cai,; Jin Min,
18th International Zurich Symposium on
Electromagnetic Compatibility
24-28 Sept. 2007 Page(s):83 - 86

Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped Element Method"
Ting-Kuang Wang; Sin-Ting Chen; Chi-Wei Tsai; Sung-Mao Wu; Drewniak, J.L.; Tzong-Lin Wu;
IEEE Transactions on
Advanced Packaging
Volume 30,  Issue 4,  Nov. 2007 Page(s):864 - 871

Embedded Capacitor Technology: A Real World Example"
Smith, N.; Jun Fan; Andresakis, J.; Fukawa, Y.; Harvey, M.; Knighten, J.;
32nd IEEE/CPMT International
Electronic Manufacturing Technology Symposium, 2007.
3-5 Oct. 2007 Page(s):118 - 124

Predictive Modeling of the Effects of Skew and Imbalance on Radiated EMI from Cables "
Chen, J.; Drewniak, J.L.; DuBroff, R.E.; Knighten, J.L.; Fan, J.; Flavin, J.;
IEEE International Symposium on Electromagnetic Compatibility
9-13 July 2007 Page(s):1 - 5 

Index