EMC Laboratory 
4000 Enterprise Dr. 
Missouri University of Science
and Technology
Rolla, MO 65401
emclab@mst.edu

Consortium Technical Papers Published in 2000

Index

“EMI from Airflow Aperture Arrays in Shielding Enclosures - Experiments, FDTD, and MOM Modeling,”
M. Li, J. Nuebel, J. L. Drewniak, T. H. Hubing, R. E. DuBroff, and T. P. Van Doren
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-42, no. 3, August 2000, pp. 265-275.

“A Novel Preconditioning Technique and Comparison of Three Formulations for Hybrid FEM/MOM Methods,”
Y. Ji, H. Wang and T. Hubing
Journal of the Applied Computational Electromagnetics Society
vol. 15, no. 2, August 2000, pp. 103-114.

“EMI Reduction from Airflow Aperture Arrays using Dual Perforated Screens with Loss,”
M. Li, J. Nuebel, J. L. Drewniak, T. H. Hubing, R. E. DuBroff, and T. P. Van Doren
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-42, no. 2, May 2000, pp. 135-141.

"FDTD Modeling of Lumped Ferrites,"
M. Li, X. Luo and J. Drewniak
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-42, no. 2, May 2000, pp. 142-151.

EMAP5: A 3D Hybrid FEM/MOM Code
Y. Ji and T. Hubing
Journal of the Applied Computational Electromagnetics Society
vol. 15, no
. 1, March 2000, pp. 1-12.

EMI from Cavity Modes of Shielding Enclosures - FDTD Modeling and Measurements
M. Li, J. Nuebel, J. Drewniak, R. DuBroff, T. Hubing and T. Van Doren
IEEE Transactions on Electromagnetic Compatibility
vol. 42, no. 1, February 2000, pp. 29-38.

DC power bus design with FDTD modeling including a dispersive media
X. Ye, J. Fan, M. Koledintseva and J. Drewniak
Proc. of the 9th Topical Meeting on Electrical Performance of Electronic Packaging
Scottsdale, Arizona, October 2000, pp. 55-58.

DC power bus modeling using a circuit extraction approach based on a mixed-potential integral equation formulation and an iterative equation solver
J. Fan, J. Drewniak and J. Knighten
Proc. of the 9th Topical Meeting on Electrical Performance of Electronic Packaging
Scottsdale, Arizona, October 2000, pp. 143-146.

DC power bus modeling and design with FDTD
W. Cui, X. Ye, M. Li, J. Drewniak and D. Hockanson
Proc. of the 4th European Symposium on Electromagnetic Compatibility
Brugge, Belgium, September 2000, pp. 291-295.

Modeling and design of DC power buses on multi-layer PCBs including dielectric losse s
J. Fan, J. Drewniak, H. Shi and J. Knighten
Proc. of the 4th European Symposium on Electromagnetic Compatibility
Brugge, Belgium, September 2000, pp. 575-579.

Printed circuit board power bus decoupling using embedded capacitance
T. Hubing, M. Xu, J. Chen, J. Drewniak, T. Van Doren and R. DuBroff
Proc. of the 4th European Symposium on Electromagnetic Compatibility
Brugge, Belgium, September 2000, pp. 639-642.

Development of a closed-form expression for the input impedance of power-ground plane structures
M. Xu, Y. Ji, T. Hubing, T. Van Doren, J. Drewniak and R. DuBroff
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 77-82.

FDTD and FEM/MOM modeling of EMI resulting from a trace near a PCB edge
D. Berg, Y. Ji, X. Ye, J. Drewniak, T. Hubing, R. DuBroff, T. Van Doren and M. Tanaka
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 135-140.

EMC analysis of an 18” LCD monitor
T. Zeeff, T. Hubing, J. Drewniak, R. DuBroff and T. Van Doren
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 169-174.

Experimental evaluation of power bus decoupling on a 4-layer printed circuit board
J. Chen, M. Xu, T. Hubing, J. Drewniak, T. Van Doren, and R. DuBroff
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 335-338.

Experimental and numerical study of the radiation from microstrip bends
H. Wang, Y. Ji, T. Hubing, J. Drewniak, T. Van Doren and R. DuBroff
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 739-742.

Experimental and FDTD study of the EMI performance of an open-pin-field connector for modules-on-backplanes
X. Ye, J. Drewniak, R. DuBroff, T. Van Doren, T. Hubing and J. Nadolny
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 789-794.

Finite element modeling of patch antenna and cavity sources
Y. Ji, T. Hubing and J. Drewniak
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 811-814.

The EMI benefits of ground plane stitching in multi-layer power bus stacks
X. Ye, W. Cui, J. Drewniak, T. van Doren, T. Hubing, R. DuBroff, D. Hockanson, S. Radu, and M. Li
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 833-838.

EMI resulting from signal via transitions through the DC power bus
W. Cui, X. Ye, B. Archambeault, D. White, M. Li, and J. Drewniak
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 821-826.

Quantifying Decoupling Capacitor Location
J. Fan, J. Knighten, A. Orlandi, N. Smith and J. Drewniak
Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility
Washington D.C., August 2000, pp. 757-762.

Techniques for optimizing FEM/MoM codes
Y. Ji, T. Hubing and H. Wang
Proceedings of the 16th Annual Review of Progress in Applied Computational Electromagnetics
Monterey, CA, March, 2000, pp. 444-451.

An MPIE-based circuit extraction technique and its applications on power bus modeling in high-speed digital designs
J. Fan, H. Shi, J. Knighten and J. Drewniak
Proceedings of the 16th Annual Review of Progress in Applied Computational Electromagnetics
Monterey, CA, March, 2000, pp. 130-137.

Index