EMC Laboratory 
4000 Enterprise Dr. 
Missouri University of Science
and Technology
Rolla, MO 65401
emclab@mst.edu

Consortium Technical Papers Published in 2001

Index

Quantifying SMT Decoupling Capacitor Placement in DC Power-Bus Design for Multilayer PCBs
J. Fan, J. Drewniak, J. Knighten, N. Smith, A. Orlandi, T. Van Doren, T. Hubing and R. DuBroff
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-43, no. 4, November 2001, pp. 588-599.

DC Power-Bus Design using FDTD Modeling with Dispersive Media and Surface Mount Technology Components
X. Ye, M. Koledintseva, M. Li and J. Drewniak
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-43, no. 4, November 2001, pp. 579-587.

EMI Mitigation with Multilayer Power-Bus Stacks and Via Stitching of Reference Planes
X. Ye, D. Hockanson, M. Li, Y. Ren, W. Cui, J. Drewniak and R. DuBroff
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-43, no. 4, November 2001, pp. 538-548.

DC Power-Bus Modeling and Design With a Mixed-Potential Integral-Equation Formulation and Circuit Extraction
J. Fan, J. Drewniak, H. Shi and J. Knighten
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-43, no. 4, November 2001, pp. 426-436.

EMI Considerations in Selecting Heat-Sink-Thermal-Gasket Materials
Y. Huang, J. Butler, M. de Sorgo, R. DuBroff, T. Hubing, J. Drewniak and T. Van Doren
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-43, no. 3, August 2001, pp. 254-260.

An EMI Estimate for Shielding-Enclosure Evaluation
M. Li, J. Drewniak, S. Radu, J. Nuebel, T. Hubing, R. DuBroff and T. Van Doren
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-43, no. 3, August 2001, pp. 295-304.

Modeling DC Power-Bus Structures with Vertical Discontinuities Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation
J. Fan, H. Shi, A. Orlandi, J. L. Knighten and J. L. Drewniak
IEEE Transactions on Advanced Packaging
vol. 24, no. 2, May 2001, pp. 143-157.

Incorporating Two-Port Networks with S-Parameters into FDTD
X. Ye and J. L. Drewniak
IEEE Microwave and Wireless Components Letters
vol. 11, no. 2, Feb. 2001, pp. 77-79.

FDTD and Experimental Investigation of EMI from Stacked-Card PCB Configurations
D.M. Hockanson, X. Ye, J. L. Drewniak, T. H. Hubing, T. P. Van Doren and R. E. DuBroff
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-43, no. 1, February 2001, pp. 1-10.

Modeling Printed Circuit Boards with Embedded Decoupling Capacitance
M. Xu, T. Hubing, J. Drewniak, T. Van Doren and R. DuBroff
Proceedings of the 14th International Zurich Symp. And Technical Exhibition on EMC
Zurich, Switzerland, Feb. 2001, paper #: 96O2

The Effects of Via Transitions on Differential Signals
C. Wang, J. Fan, J. Knighten, N. Smith, R. Alexander and J. Drewniak
Proceedings of the 2001 Electrical Performance of Electronic Packaging Conference
Cambridge, MA, Oct. 2001, pp. 39-42

Reducing Power Bus Impedance at Resonance with Lossy Components
T. Zeeff and T. Hubing
Proceedings of the 2001 Electrical Performance of Electronic Packaging Conference
Cambridge, MA, Oct. 2001, pp. 61-64

Calculation of Self and Mutual Inductances Associated with Vias in a DC Power Bus Structure from a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation
J. Fan, J. Drewniak, J. Knighten, N. Smith and A. Orlandi
Proceedings of the 14th International Zurich Symp. And Technical Exhibition on EMC
Zurich, Switzerland, Feb. 2001, paper #: 97O3

FDTD Modeling of EMI Due to Coupling from PCB Traces to a Heatspreader/Heatpipe Structure
C. Wang, X. Ye, J. Drewniak, J.L. Knighten, D. Wang and R. Alexander
Proceedings of the 14th International Zurich Symp. And Technical Exhibition on EMC
Zurich, Switzerland, Feb. 2001, paper #: 101O7

Including SMT Ferrite Beads in DC Power Bus and High-Speed I/O Line Modeling
J. Fan, S. Luan and J. Drewniak
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 336-339.

Improving the High-Frequency Attenuation of Shunt Capacitor, Low-Pass Filters
C. Olsen, T. Van Doren, T. Hubing, J. Drewniak and R. DuBroff
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 487-489.

Mitigating Power Bus Noise with Embedded Capacitance in PCB Designs
M. Xu, T. Hubing, J. Chen, J. Drewniak, T. Van Doren and R. DuBroff
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 496-500.

Investigation of PCB Layout Parasitics in EMI Filtering of I/O Lines
X. Ye, G. Liu and J. Drewniak
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 501-504.

Representation of Gyromagnetic Composite Media for FDTD Modeling
M. Koledintseva, J. Drewniak and X. Ye
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 555-558.

Challenge Problem Update: PEEC and MOM Analysis of a PC Board with Long Wires Attached
H. Wang, B. Archambeault and T. Hubing
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 811-814.

Estimation of Printed Circuit Board Power Bus Noise at Resonance Using a Simple Transmission Line Model
H. Hu, T. Hubing and T. Van Doren
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 896-898.

DC Power Bus Noise Isolation with Power Islands
W. Cui, Jun Fan, H. Shi and J. Drewniak
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 899-903.

Grounding of Heatpipe/Heatspreader and Heatsink Structures for EMI Mitigation
C. Wang, J. Drewniak, J. Knighten, D. Wang, R. Alexander and D. Hockanson
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 916-920.

Differential Signalling in PCBs: Modeling and Validation of Dielectric Losses and Effects of Discontinuities
R. Araneo, C. Wang, X. Gu, S. Celozzi and J. Drewniak
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 933-938.

20-H Rule Modeling and Measurements
H. W. Shim and T. H. Hubing
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 939-942.

Applying the Method of Moments and the Partial Element Equivalent Circuit Modeling Techniques to a Special Challenge Problem of a PC Board with Long Wires Attached
Y. Ji, B. Archambeault and T. Hubing
Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility
Montreal, Canada, August 2001, pp. 1322-1326.

Index