## Consortium Technical Papers Published in 2001

**Quantifying SMT Decoupling Capacitor Placement in DC Power-Bus Design for Multilayer PCBs** J. Fan, J. Drewniak, J. Knighten, N. Smith, A. Orlandi, T. Van Doren, T. Hubing and R. DuBroff

IEEE Transactions on Electromagnetic Compatibility

vol. EMC-43, no. 4, November 2001, pp. 588-599.

**DC Power-Bus Design using FDTD Modeling with Dispersive Media and Surface Mount Technology Components** X. Ye, M. Koledintseva, M. Li and J. Drewniak

IEEE Transactions on Electromagnetic Compatibility

vol. EMC-43, no. 4, November 2001, pp. 579-587.

**EMI Mitigation with Multilayer Power-Bus Stacks and Via Stitching of Reference Planes** X. Ye, D. Hockanson, M. Li, Y. Ren, W. Cui, J. Drewniak and R. DuBroff

IEEE Transactions on Electromagnetic Compatibility

vol. EMC-43, no. 4, November 2001, pp. 538-548.

**DC Power-Bus Modeling and Design With a Mixed-Potential Integral-Equation Formulation and Circuit Extraction** J. Fan, J. Drewniak, H. Shi and J. Knighten

IEEE Transactions on Electromagnetic Compatibility

vol. EMC-43, no. 4, November 2001, pp. 426-436.

**EMI Considerations in Selecting Heat-Sink-Thermal-Gasket Materials** Y. Huang, J. Butler, M. de Sorgo, R. DuBroff, T. Hubing, J. Drewniak and T. Van Doren

IEEE Transactions on Electromagnetic Compatibility

vol. EMC-43, no. 3, August 2001, pp. 254-260.

**An EMI Estimate for Shielding-Enclosure Evaluation** M. Li, J. Drewniak, S. Radu, J. Nuebel, T. Hubing, R. DuBroff and T. Van Doren

IEEE Transactions on Electromagnetic Compatibility

vol. EMC-43, no. 3, August 2001, pp. 295-304.

**Modeling DC Power-Bus Structures with Vertical Discontinuities Using a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation** J. Fan, H. Shi, A. Orlandi, J. L. Knighten and J. L. Drewniak

IEEE Transactions on Advanced Packaging

vol. 24, no. 2, May 2001, pp. 143-157.

**Incorporating Two-Port Networks with S-Parameters into FDTD** X. Ye and J. L. Drewniak

IEEE Microwave and Wireless Components Letters

vol. 11, no. 2, Feb. 2001, pp. 77-79.

**FDTD and Experimental Investigation of EMI from Stacked-Card PCB Configurations** D.M. Hockanson, X. Ye, J. L. Drewniak, T. H. Hubing, T. P. Van Doren and R. E. DuBroff

IEEE Transactions on Electromagnetic Compatibility

vol. EMC-43, no. 1, February 2001, pp. 1-10.

**Modeling Printed Circuit Boards with Embedded Decoupling Capacitance** M. Xu, T. Hubing, J. Drewniak, T. Van Doren and R. DuBroff

Proceedings of the 14th International Zurich Symp. And Technical Exhibition on EMC

Zurich, Switzerland, Feb. 2001, paper #: 96O2

**The Effects of Via Transitions on Differential Signals** C. Wang, J. Fan, J. Knighten, N. Smith, R. Alexander and J. Drewniak

Proceedings of the 2001 Electrical Performance of Electronic Packaging Conference

Cambridge, MA, Oct. 2001, pp. 39-42

**Reducing Power Bus Impedance at Resonance with Lossy Components** T. Zeeff and T. Hubing

Proceedings of the 2001 Electrical Performance of Electronic Packaging Conference

Cambridge, MA, Oct. 2001, pp. 61-64

**Calculation of Self and Mutual Inductances Associated with Vias in a DC Power Bus Structure from a Circuit Extraction Approach Based on a Mixed-Potential Integral Equation Formulation** J. Fan, J. Drewniak, J. Knighten, N. Smith and A. Orlandi

Proceedings of the 14th International Zurich Symp. And Technical Exhibition on EMC

Zurich, Switzerland, Feb. 2001, paper #: 97O3

**FDTD Modeling of EMI Due to Coupling from PCB Traces to a Heatspreader/Heatpipe Structure** C. Wang, X. Ye, J. Drewniak, J.L. Knighten, D. Wang and R. Alexander

Proceedings of the 14th International Zurich Symp. And Technical Exhibition on EMC

Zurich, Switzerland, Feb. 2001, paper #: 101O7

**Including SMT Ferrite Beads in DC Power Bus and High-Speed I/O Line Modeling** J. Fan, S. Luan and J. Drewniak

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 336-339.

**Improving the High-Frequency Attenuation of Shunt Capacitor, Low-Pass Filters** C. Olsen, T. Van Doren, T. Hubing, J. Drewniak and R. DuBroff

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 487-489.

**Mitigating Power Bus Noise with Embedded Capacitance in PCB Designs** M. Xu, T. Hubing, J. Chen, J. Drewniak, T. Van Doren and R. DuBroff

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 496-500.

**Investigation of PCB Layout Parasitics in EMI Filtering of I/O Lines** X. Ye, G. Liu and J. Drewniak

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 501-504.

**Representation of Gyromagnetic Composite Media for FDTD Modeling** M. Koledintseva, J. Drewniak and X. Ye

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 555-558.

**Challenge Problem Update: PEEC and MOM Analysis of a PC Board with Long Wires Attached** H. Wang, B. Archambeault and T. Hubing

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 811-814.

**Estimation of Printed Circuit Board Power Bus Noise at Resonance Using a Simple Transmission Line Model** H. Hu, T. Hubing and T. Van Doren

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 896-898.

**DC Power Bus Noise Isolation with Power Islands** W. Cui, Jun Fan, H. Shi and J. Drewniak

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 899-903.

**Grounding of Heatpipe/Heatspreader and Heatsink Structures for EMI Mitigation** C. Wang, J. Drewniak, J. Knighten, D. Wang, R. Alexander and D. Hockanson

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 916-920.

**Differential Signalling in PCBs: Modeling and Validation of Dielectric Losses and Effects of Discontinuities** R. Araneo, C. Wang, X. Gu, S. Celozzi and J. Drewniak

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 933-938.

**20-H Rule Modeling and Measurements** H. W. Shim and T. H. Hubing

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 939-942.

**Applying the Method of Moments and the Partial Element Equivalent Circuit Modeling Techniques to a Special Challenge Problem of a PC Board with Long Wires Attached** Y. Ji, B. Archambeault and T. Hubing

Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility

Montreal, Canada, August 2001, pp. 1322-1326.