EMC Laboratory 
4000 Enterprise Dr. 
Missouri University of Science
and Technology
Rolla, MO 65401
emclab@mst.edu

Consortium Technical Papers Published in 2002

Index

Estimating the Power Bus Impedance of Printed Circuit Boards with Embedded Capacitance
M. Xu and T. Hubing
IEEE Transactions on Advanced Packaging
vol. 25, no. 3, Aug. 2002, pp. 424-432.

On the modeling of a gapped power bus structure using a hybrid FEM/MOM approach
Y. Ji and T. Hubing
IEEE Transactions on Electromagnetic Compatibility
vol. 44, no. 4, Nov. 2002, pp. 566-569.

Finite element modeling of coaxial cable feeds and vias in power bus structures
H. Wang, Y. Ji and T. Hubing
IEEE Transactions on Electromagnetic Compatibility
vol. 44, no. 4, Nov. 2002, pp. 569-574.

Estimating the Noise Mitigation Efect of Local Decoupling in Printed Circuit Boards
J. Fan, W. Cui, J. Drewniak, T. Van Doren, J. Knighten
IEEE Transactions on Advanced Packaging
vol. 25, no. 2, May 2002, pp. 154-165.

Reducing Power Bus Impedance at Resonance with Lossy Components
T. Zeeff and T. Hubing
IEEE Transactions on Advanced Packaging
vol. 25, no. 2, May 2002, pp. 307-310.

Efficient Modeling of Discontinuities and Dispersive Media in Printed Transmission Lines
R. Araneo, C. Wang, X. Gu, J. Drewniak and S. Celozzi
IEEE Transactions on Electromagnetic Compatibility
vol. 38, no. 2, March 2002, pp. 765-768.

On the interior resonance problem when applying a hybrid FEM/MoM approach to model printed circuit boards
Y. Ji and T. Hubing
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-44, no. 2, May 2002, pp. 318-323.

Power bus isolation using power islands in printed circuit boards
J. Chen, T. Hubing, T. Van Doren, R. DuBroff
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-44, no. 2, May 2002, pp. 373-379.

High-Performance Inter-PCB Connectors: Analysis of EMI Characteristics
X. Ye, J. Drewniak, J. Nadolny and D. Hockanson
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-44, no. 1, February 2002, pp. 165-174.

FDTD Modeling Incorporating a Two-Port Network for I/O Line EMI Filtering Design
X. Ye and J. Drewniak
IEEE Transactions on Electromagnetic Compatibility
vol. EMC-44, no. 1, February 2002, pp. 175-181.

Application of Higher-Order FEM elements to the analysis of microstrip structures
H. Wang, C. Guo, T. Hubing, J. Drewniak, T. Van Doren and R. DuBroff
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 1015-1019.

Decoupling strategies for printed circuit boards without power planes
H. W. Shim, T. Zeeff and T. Hubing
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 258-261.

An expert system architecture to detect system-level automotive EMC problems
S. Ranganathan, D. Beetner, R. Wiese and T. Hubing
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 976-981.

Field extraction from near field scanning for a microstrip structure
L. Zhang, K. Slattery, C. Wang, M. Yamaguchi, K. Arai, R. DuBroff, J. Drewniak, D. Pommerenke and T. Hubing
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 589-592.

Anticipating full vehicle radiated EMI from module-level testing in automobiles
G. Liu, C. Chen, Y. Tu and J. Drewniak
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 982-986.

FDTD analysis of printed circuit boards containing wideband lorentzian dielectric dispersive media
M. Koledintseva, D. Pommerenke and J. Drewniak
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 830-833.

Transmission line modeling of vias in differential signals
C. Wang, J. Drewniak, J. Fan, J. Knighten, N. Smith, R. Alexander
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 249-252.

External parasitic inductance in microstrip and stripline geometries of finite size
M. Koledintseva, J. Drewniak, T. Van Doren and D. Hockanson
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 244-248.

Alternatives to gaskets in shielding an enclosure
F. Centola, D. Pommerenke, X. Kai and J. Drewniak
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 205-209.

Modeling noise coupling from non-parallel PCB trace routing
S. Luan, F. Xiao, W. Liu, J. Fan, Y. Kami, J. Drewniak and R. DuBroff
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 109-112.

Numerical modeling of ESD Simulators
K. Wang, D. Pommerenke and R. Chundru
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 93-98.

ESD currents and fields on the VCP and the HCP modeled using quasi-static approximations
D. Pommerenke, T. Van Doren and K. Wang
Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility
Minneapolis, MN, August 2002, pp. 81-86.

Index