Consortium Technical Papers Published in 2003

Index

“Analysis of Simple Two-Capacitor Low-Pass Filters,”
T. Zeeff, T. Hubing, T. Van Doren and D. Pommerenke
IEEE Transactions on Electromagnetic Compatibility
vol. 45, no. 4, Nov. 2003, pp. 595-601.

“The Development of a Closed-Form Expression for the Input Impedance of Power-Return Plane Structures,”
M. Xu and T. Hubing
IEEE Transactions on Electromagnetic Compatibility
vol. 45, no. 3, Aug. 2003, pp. 478-485.

Impedance Boundary Conditions in a Hybrid FEM/MOM Formulation
H. Wang, M. Xu, C. Wang and T. Hubing
IEEE Transactions on Electromagnetic Compatibility
vol. 45, no. 2, May 2003, pp. 198-206.

Numerical Modeling of Electrostatic Discharge Generators
K. Wang, D. Pommerenke, R. Chundru, T. Van Doren, J. Drewniak, and A. Shashindranath
IEEE Transactions on Electromagnetic Compatibility
vol. 45, no. 2, May 2003, pp. 258-271.

Lumped-Circuit Model Extraction for Vias in Multilayer Substrates
J. Fan, J. Drewniak and J. Knighten
IEEE Transactions on Electromagnetic Compatibility
vol. 45, no. 2, May 2003, pp. 272-280.

DC Power Bus Noise Isolation With Power Plane Segmentation
W. Cui, J. Fan, Y. Ren, H. Shi, J. Drewniak and R. DuBroff
IEEE Transactions on Electromagnetic Compatibility
vol. 45, no. 2, May 2003, pp. 436-443.

Application of Hierarchical Higher-Order Tangential Vector Finite Elements in a Hybrid FEM/MoM Method
H. Wang, C. Guo and T. Hubing
Journal of the Applied Computational Electromagnetics Society
vol. 18, no. 1, March 2003, pp. 1-11.

Application of the cavity model to lossy power-return plane structures in printed circuit boards
M. Xu, H. Wang and T. H. Hubing
IEEE Transactions on Advanced Packaging
vol. 26, no. 1, Feb. 2003, pp. 73-80.

Investigation of interior resonances in the hybrid FEM/MoM method
Y. Ji, T. Hubing and H. Wang
IEEE Transactions on Antennas and Propagation
vol. 45, no. 1, Feb. 2003, pp. 22-30.

Power-Bus Decoupling with Embedded Capacitance in Printed Circuit Board Design
M. Xu, T. H. Hubing, J. Chen, T. P. Van Doren, J. L. Drewniak and R. E. DuBroff
IEEE Transactions on Electromagnetic Compatibility
vol. 45, no. 1, Feb. 2003, pp. 22-30.

Printed Circuit Board EMI Source Mechanisms
T. Hubing
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 1-3.

PCB EMC Design Guidelines: A Brief Annotated List
T. Hubing
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 34-37.

Impact of ESD Generator Parameters on Failure Level in Fast CMOS System
K. Wang, D. Pommerenke, R. Chundru, J. Huang, K. Xiao, P. Ilavarasan, and M. Schaffer
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 52-57.

ESD Excitation Model for Susceptibility Study
F. Centola, D. Pommerenke, W. Kai, T. Van Doren and S. Caniggia
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 58-63.

Modeling Issues for Full-Wave Numerical EMI Simulation
M. Cracraft, X. Ye, C. Wang, S. Chandra and J. Drewniak
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 335-340.

Common-mode and Differential-mode Analysis of Common Mode Chokes
Z. Li, D. Pommerenke and Y. Shimoshio
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 384-387.

Anticipating Vehicle-Level EMI Using A Multi-Step Approach
G. Liu, D. Pommerenke, J. Drewniak, R. Kautz and C. Chen
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 419-424.

FDTD Method Capable of Attaching Rectangular Domains
K. Xiao, D. Pommerenke and J. Drewniak
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 429-433.

Memory DIMM DC Power Distribution Analysis and Design
J. Mao, C. Wang, G. Selli, B. Archambeault and J. Drewniak
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 597-602.

Investigation of Potential Resonances in CEMPIE-PEEC Simulations of Multilayered PCBs
R. Araneo and S. Luan
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 642-647.

Anticipating EMI Using Transfer Functions and Signal Integrity
C. Wang, J. Drewniak and J. Nadolny
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 695-698.

FDTD Data Extrapolation Using Multilayer Perceptron (MLP)
H. Goksu, D. Pommerenke and D. Wunsch
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 735-737.

SPICE Model Libraries for Via Transitions
S. Luan, G. Selli, J. Fan, M. Lai, J. Knighten, N. Smith, R. Alexander, G. Antonini, A. Ciccomancini, A. Orlandi and J. Drewniak
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 859-864.

Quantifying the Effects on EMI and SI of Source Imbalances in Differential Signaling
C. Wang and J. Drewniak
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 865-868.

Power and Ground-Reference Plane Impedance Determination as Decoupling Capacitor Distance Increases
B. Archambeault, J. Wang and S. Connor
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 875-880.

Reconstruction of the Parameters of Debye and Lorentzian Dispersive Media using a Genetic Algorithm
J. Zhang, M. Koledintseva, G. Antonini, J. Drewniak, K. Rozanov and A. Orlandi
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 898-903.

FDTD Modeling of Isotropic Dispersive Magnetic Materials
J. Wu, J. Drewniak, M. Koledintseva and D. Pommerenke
Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility
Boston, MA, August 2003, pp. 904-909.

Index