Consortium Technical Papers Published in 2004

Index

"Development and Application of a Fast Multipole Method in a Hybrid FEM/MoM Field Solver,”
C. Guo and T. Hubing
Journal of the Applied Computational Electromagnetics Society
vol. 19, no. 3, Nov. 2004, pp. 126-134.

"Characterization of Human Metal ESD Reference Discharge Event and Correlation of Generator Parameters to Failure Levels—Part II: Correlation of Generator Parameters to Failure Levels,”
K. Wang, D. Pommerenke, R. Chundru, T. Van Doren, F. Centola, J. Huang
IEEE Transactions on Electromagnetic Compatibility
vol. 46, no. 4, November 2004, pp. 505-511.

"Characterization of Human Metal ESD Reference Discharge Event and Correlation of Generator Parameters to Failure Levels—Part I: Reference Event,”
R. Chundru, D. Pommerenke, K. Wang, T. Van Doren, F. Centola, J. Huang
IEEE Transactions on Electromagnetic Compatibility
vol. 46, no. 4, November 2004, pp. 498-504.

"Partial Discharge on-line Monitoring for HV Cable Systems Using Electrooptic Modulators,”
Y. Tian, P. Lewin, D. Pommerenke, J. Wilkinson, S. Sutton
IEEE Transactions on Dielectrics and Electrical Insulation
vol. 11, no. 5, October 2004, pp. 861-869.

"Electromagnetic Interference (EMI) of System-on-Package (SOP,”
T. Sudo, H. Sasaki, N. Masuda, J. Drewniak
IEEE Transactions on Advanced Packaging
vol. 27, no. 2, May 2004, pp. 304-314.

"Susceptibility Characterization of a Cavity with an Aperture by using Slowly Rotating EM Fields: FDTD Analysis and Measurements,”
K. Murano, T. Sanpei, F. Xiao, C. Wang, Y. Kami, J. Drewniak
IEEE Transactions on Electromagnetic Compatibility
vol. 46, no. 2, May 2004, pp. 169-177.

"Common-Mode Current Due to a Trace near a PCB Edge and its Suppression by a Guard Band,”
Y. Kayano, M. Tanaka, J. Drewniak, H. Inoue
IEEE Transactions on Electromagnetic Compatibility
vol. 46, no. 1, Feb. 2004, pp. 46-53.

"Using Near-Field Scanning to Predict Radiated Fields,”
J. Shi, M. Cracraft, J. Zhang, R. DuBroff, K. Slattery, M. Yamaguchi
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 14-18.

“Expert System Algorithms for Identifying Radiated Emission Problems in Printed Circuit Boards,”
H. Shim, T. Hubing, T. Van Doren, R. DuBroff, J. Drewniak, D. Pommerenke, R. Kaires
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 57-62.

“Static and Quasi-Dynamic Load Balancing in Parallel FDTD Codes for Signal Integrity, Power Integrity and Packaging Applications,”
S. Seguin, M. Cracraft, J. Drewniak
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 107-112.

“An Extrapolation Procedure to Shorten Time Domain Simulations,”
G. Selli, J. Drewniak, D. Pommerenke
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 113-117.

“A Three-Dimensional FDTD Subgridding Algorithm Based on Interpolation of Current Density,”
K. Xiao, D. Pommerenke, J. Drewniak
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 118-123.

“A New Calibration Method for Current Probes,”
R. Chundru, D. Pommerenke, S. Chandra
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 163-168.

“Analysis of Chip-Level EMI using Near-Field Magnetic Scanning,”
X. Dong, S. Deng, T. Hubing, D. Beetner
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 174-177.

“Representation of Permittivity for Multiphase Dielectric Mixtures in FDTD Modeling,”
M. Koledintseva, J. Wu, J. Zhang, J. Drewniak, K. Rozanov
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 309-314.

“The PCB Level ESD Immunity Study by using 3 Dimension ESD Scan System,”
K. Wang, D. Pommerenke, J. Zhang, R. Chundru
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 343-348.

“A Time Domain Approach to Estimate Current Draw from SMT Decoupling Capacitors,”
L. Zhang, B. Archambeault, S. Conner, J. Knighten, J. Fan, N. Smith, R. Alexander, R. DuBroff, J. Drewniak
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 377-382.

“Via Coupling within Power-Return Plane Structures Considering the Radiation Loss,”
R. Chen, J. Chen, T. Hubing, W. Shi
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 386-391.

“Radiated Emissions from Populated Printed Circuit Boards due to Power Bus Noise,”
H. Shim, Y. Fu, T. Hubing
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 396-400.

“A Circuit Approach to Model Narrow Slot Structures in a Power Bus,”
L. Zhang, B. Archambeault, S. Conner, J. Knighten, J. Fan, N. Smith, R. Alexander, R. DuBroff, J. Drewniak
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 401-406.

“A Preliminary Study of Maximum Suystem-Level Crosstalk at High Frequencies for Coupled Transmission Lines,”
X. Dong, H. Weng, D. Beetner, T. Hubing, R. Wiese, J. McCallum
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 419-425.

“Extracting R, L, G, C Parameters of Dispersive Planar Transmission Lines from Measured S-Parameters using a Genetic Algorithm,”
J. Zhang, M. Koledintseva, J. Drewniak, G. Antonini, A. Orlandi, K. Rozanov
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 572-576.

“Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling,”
S. Luan, G. Selli, J. Drewniak, A. De Luca, G. Antonini, A. C. Scogna, A. Orlandi, J. Fan, J. Knighten, N. Smith, R. Alexander
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 577-582.

“Validation of Equivalent Circuits Extracted from S-Parameter Data for Eye-Pattern,”
G. Selli, M. Lai, S. Luan, J. Drewniak, R. DuBroff, J. Fan, J. Knighten, N. Smith, G. Antonini, A. Orlandi, B. Archambeault, S. Connor
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 666-671.

“Investigation of Cavity Resonances in an Automobile,”
H. Weng, D. Beetner, T. Hubing, X. Dong, R. Wiese, J. McCallum
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 766-770.

“Anticipating EMI and On-Board Interference in Automotive Platforms,”
S. Sun, G. Liu, D. Pommerenke, J. Drewniak, R. Kautz, C. Chen
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 792-797.

“Extraction of SPICE-Type Equivalent Circuits of Signal Via Transitions Using The PEEC Method,”
J. Mao, J. Drewniak, G. Antonini, A. Orlandi
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 980-983.

“The Design of a Lumped Element Impedance-Matching Network with Reduced Parasitic Effects Obtained from Numerical Modeling,”
S. Luan, J. Fan, J. Knighten, R. Alexander
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 984-987.

“Comparison of Via Equivalent Circuit Model Accuracy Using Quasi-Static and Full-Wave Approaches,”
B. Archambeault, S. Connor, J. Zhang, J. Drewniak, M. Lai, A. Orlandi, G. Antonini, A. Ruehli
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 994-999.

“Effects of Open Stubs Associated with Plated Through-Hole Vias in Backpanel Designs,”
S. Deng, J. Mao, T. Hubing, J. Drewniak, J. Fan, J. Knighten, N. Smith, R. Alexander, C. Wang
Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility
Santa Clara, CA, August 2004, pp. 1017-1022.

“3D Modeling and Circuit Model Extraction of Vias in Multilayer Printed Circuit Boards,”
G. Selli, J. Zhang, M. Lai, A. De Luca, A. Ciccomancini, B. Archambeault, G. Antonini, J. Drewniak, A. Orlandi, J. Fan and J. Knighten
Proc. of the Progress in Electromagnetics Research Symposium (PIERS 2004)
Pisa, Italy, March 2004.

“Efficient Capacitance Calculations for PEEC Circuit Analysis,”
J. Mao, G. Antonini, A. Orlandi and J. Drewniak
Proc. of the Progress in Electromagnetics Research Symposium (PIERS 2004)
Pisa, Italy, March 2004.

“Application of A Genetic Algorithm for Extracting Parameters of Dispersive Curves for a Planar Composite Layer,”
J.Zhang, K.Hu, M.Y.Koledintseva, J.L.Drewniak and R.T.Johnk
Proc. of the Progress in Electromagnetics Research Symposium (PIERS 2004)
Pisa, Italy, March 2004.

“Extracting a SPICE Compatible Equivalent Circuit from Measured S-Parameter Data,”
G. Selli, A. De Luca, S. Luan, G. Antonini, J. Drewniak, J. Knighten, J. Fan, and A. Orlandi
Proc. of the EMC'04 Sendai Symposium
Sendai, Japan, June 2004.

“Extracting R, L, G, C Parameters of Microstrip and Striplines with Dispersive Substrates,”
J. Zhang, M. Koledintseva and J. Drewniak
Proc. of the EMC'04 Sendai Symposium
Sendai, Japan, June 2004.

“Radiation Mechanisms for Semiconductor Devices and Packages,”
T. Hubing, D. Beetner, S. Deng and X. Dong
Proc. of the EMC'04 Sendai Symposium
Sendai, Japan, June 2004.

“Frequency Domain Compensation of Probe Induced Disturbances in Near Field Measurements,”
J. Shi, R. DuBroff, M. Yamaguchi and K. Slattery
Proc. of the EMC'04 Sendai Symposium
Sendai, Japan, June 2004.

Index