The objective of this project is to develop enclosure design methodologies, tools, and guidelines for quantifying shielding performance; and, to identify and quantify coupling paths (and mitigation approaches) at the PCB level that excite cavity modes, which can lead to EMI through perforations in the enclosure. Recent work has focused on an investigation of the ways that heatpipes and heatspreaders drive shielded enclosures. Future work will be directed towards the analysis of new shielded enclosure technologies.