EMC Laboratory 
4000 Enterprise Dr. 
Missouri University of Science
and Technology
Rolla, MO 65401
emclab@mst.edu

Technical Papers Published in 2010

 Index

“A Novel Impedance Definition of a Parallel Plate Pair for an Intrinsic Via Circuit Model”
Zhang, Y.-J.; Feng, G.; Fan, J.;
Microwave Theory and Techniques, IEEE Transactions on, Volume: 58, Issue: 1
Digital Object Identifier: 10.1109/TMTT.2010.2083870
Publication Year: 2010, Page(s): 3780 – 3789
 
“Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters”
De Paulis, F.; Yao-Jiang Zhang; Jun Fan;
Electromagnetic Compatibility, IEEE Transactions on
Volume: 52, Issue: 4
Digital Object Identifier: 10.1109/TEMC.2010.2072784
Publication Year: 2010, Page(s): 1008 - 1018

“An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis” 
Yao-Jiang Zhang; Jun Fan;
Microwave Theory and Techniques, IEEE Transactions on
Volume: 58, Issue: 8
Digital Object Identifier: 10.1109/TMTT.2010.2052956
Publication Year: 2010, Page(s): 2251 - 2265

“Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards with Vias and Decoupling Capacitors” 
Yao-Jiang Zhang; Zaw Zaw Oo; Xing-Chang Wei; En-Xiao Liu; Jun Fan; Er-Ping Li;
Electromagnetic Compatibility, IEEE Transactions on
Volume: 52, Issue: 2
Digital Object Identifier: 10.1109/TEMC.2010.2040389
Publication Year: 2010, Page(s): 401 - 409

“Complex Permittivity and Permeability Measurements and Finite-Difference Time-Domain Simulation of Ferrite Materials” 
Jianfeng Xu; Koledintseva, M.Y.; Yaojiang Zhang; Yongxue He; Matlin, B.; DuBroff, R.E.; Drewniak, J.L.; Jianmin Zhang;
Electromagnetic Compatibility, IEEE Transactions on
Volume: 52, Issue: 4
Digital Object Identifier: 10.1109/TEMC.2010.2050693
Publication Year: 2010, Page(s): 878 - 887

“Analysis of mutual inductance effect between decoupling capacitors on planar power bus” 
Jingook Kim; Archambeault, B.; Knighten, J.L.; Jun Fan 
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on 
Digital Object Identifier: 10.1109/APEMC.2010.5475781 
Publication Year: 2010, Page(s): 313 - 316

“Modeling of noise coupling inside multilayer printed circuit boards using cavity model and segmentation technique” 
Zhenwei Yu; Jun Fan; Connor, S.; Archambeault, B.; Drewniak, J.L.;
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Digital Object Identifier: 10.1109/APEMC.2010.5475649
Publication Year: 2010, Page(s): 321 - 324

“Effects of TVS integration on system level ESD robustness” 
Wei Huang; Dunnihoo, J.; Pommerenke, D.; Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Digital Object Identifier: 10.1109/APEMC.2010.5475649
Publication Year: 2010, Page(s): 1 - 6

“Measuring IC switching current waveforms using a GMI probe for power integrity studies” 
Fan Zhou; Songping Wu; Pommerenke, D.; Kayano, Y.; Inoue, H.; Tan, K.; Jun Fan;
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Digital Object Identifier: 10.1109/APEMC.2010.5475607
Publication Year: 2010, Page(s): 317 - 320

“Measurement methodology for establishing an IC ESD sensitivity database” 
Zhen Li; Jiang Xiao; Byongsu Seol; Jongsung Lee; Pommerenke, D.;
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Digital Object Identifier: 10.1109/APEMC.2010.5475629
Publication Year: 2010, Page(s): 1051 - 1054

“Probe characterization and data process for current reconstruction by near field scanning method” 
Wei Huang; Dazhao Liu; Jiang Xiao; Pommerenke, D.; Jin Min; Muchaidze, G.;
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Digital Object Identifier: 10.1109/APEMC.2010.5475504
Publication Year: 2010, Page(s): 467 - 470

“Near field probe for detecting resonances in EMC application” 
Jiang Xiao; Dazhao Liu; Pommerenke, D.; Wei Huang; Peng Shao; Xiang Li; Jin Min; Muchaidze, G.; Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Digital Object Identifier: 10.1109/APEMC.2010.5475739
Publication Year: 2010, Page(s): 243 - 246

“FDTD modeling of absorbing materials for EMI applications” 
Xu, J.; Koledintseva, M.Y.; Soumya De; Radchenko, A.; DuBroff, R.E.; Drewniak, J.L.; Yongxue He; Johnson, R.;
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Digital Object Identifier: 10.1109/APEMC.2010.5475680
Publication Year: 2010, Page(s): 173 - 176

“Planar transmission line method for characterization of printed circuit board dielectrics” 
J. Zhang, M. Koledintseva, G. Antonini, J. Drewniak, A. Orlandi, and K. Rozanov;
Progress In Electromagnetic Research, PIER, Vol. 102, March 2010, pp. 267-286

“Causal RLGC(f) Models for Transmission Lines FromMeasured  -Parameters” 
J. Zhang, J.L.Drewniak, D.J.Pommerenke, M.Y.Koledintseva, R.E.DuBroff, W. Cheng, Z. Yang, Q.B.Chen, and A.Orlandi;
Electromagnetic Compatibility, IEEE Transactions on 
Volume: 52, Issue: 1
Digital Object Identifier: 10.1109/TEMC.2009.2035055 
Publication Year: 2010, Page(s): 189 – 198

“A new mixing rule for predicting frequency-dependent material parameters of composites” 
K. N. Rozanov, M.Y. Koledintseva, and J.L. Drewniak;
Electromagnetic Theory (EMTS), 2010 URSI International Symposium on 
Digital Object Identifier: 10.1109/URSI-EMTS.2010.5637159 
Publication Year: 2010, Page(s): 584 - 587

“Modeling of electromagnetic wave propagation in printed circuit board striplines with rough conductors” 
M.Y. Koledintseva, M. Wang, S. Shen, J. Chen, A. Koul, and J.L. Drewniak;
Abstracts, Progress In Electromagnetic Research Symposium PIERS 2010, Cambridge, MA,
Publication Year: 2010, Page(s): 462.

“A new mixing rule for frequency dependence of permeability in composites” 
K.N. Rozanov, M.Y. Koledintseva, and J. L. Drewniak;
Abstracts, Progress In Electromagnetic Research Symposium PIERS 2010, Cambridge, MA,
Publication Year: 2010, Page(s): 132.

“Effective electromagnetic parameters of composites containing magnetic platelets” 
M.Y. Koledintseva, J.L. Drewniak, and K.N. Rozanov;
Abstracts, Progress In Electromagnetic Research Symposium PIERS 2010, Cambridge, MA,
Publication Year: 2010, Page(s): 133.

“Predicting of wideband electromagnetic responses of composites containing magnetic inclusions” 
K.N. Rozanov, M.Y. Koledintseva, and J. L. Drewniak;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711392 
Publication Year: 2010, Page(s): 857 - 862

“Lumped-element circuit model of ferrite chokes” 
A. Orlando, M.Y. Koledintseva, D.G. Beetner, P. Shao, and P.H. Berger;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711373 
Publication Year: 2010, Page(s): 754 - 759

“Surface impedance approach to calculate loss in rough conductor coated with dielectric layer” 
M. Koledintseva, A. Koul, F. Zhou, J. Drewniak, and S. Hinaga;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711380 
Publication Year: 2010, Page(s): 790 - 795

“Evaluation of propagation characteristics for PCB traces with periodic roughness using ASM-FDTD method” 
M. Wang, R. Qiang, J. Chen, M. Koledintseva, A. Koul, and J. Drewniak;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711283 
Publication Year: 2010, Page(s): 269 - 273

“Thermal effects on PCB laminate material dielectric constant and dissipation factor” 
S. Hinaga, M. Koledintseva, J. Drewniak, A. Koul, and F. Zhou;
Techn. Conf. IPC Expo/APEX 2010, Las Vegas, 2010
Publication Year: 2010, paper # S16-1 (Academic Poster Award).

“A systematic approach to PCB material characterization using time domain TRL calibration” 
V. Khilkevich, M. Koledintseva, V. Sivarajan, D. Liu, B. Achkir, H. Ning, and J. Drewniak;
DesignCon, 2010, Publication Year: 2010, paper 5-TP1, Page(s): 1-17.

“Systematic analysis and engineering of absorbing materials containing ferrite or magnetic alloy inclusions for EMC applications” 
M. Koledintseva, J. Xu, J. Drewniak, Y. He, and R. Johnson;
Abstracts, Int. Conf on Microwave Magnetics ICMM-2010, Boston
Publication Year: 2010, paper 5-TP1, Page(s): 99.

“Attenuation in extended structures coated with thin magneto-dielectric absorber layer” 
M. Koledintseva, Ji Zhang, Jianfeng Xu, J. Drewniak, and T. Tsutaoka;
Abstracts, URSI Asia-Pacific RASC-2010, Toyama, Japan
Publication Year: 2010, paper E4-1.

“Microstructural and microwave absorption properties of Ba(1-x)SrxFe12o19 sintered hexaferrites” 
C. Singh, B. Narang, I.S. Hudiara, M.Y. Koledintseva, and A.A. Kitaitsev;
Abstracts, URSI Symposium AP-RASC-2010, Toyama, Japan
Publication Year: 2010, paper E4-3.

“Microstructural and Microwave Absorption Properties of Ba(1-x)Sr(x)Fe(12)O(19) Sintered Hexaferrites” 
C. Singh, S.B. Narang, I.S. Hudiara, M.Y. Koledintseva, and A.A. Kitaitsev;
Young Scientist Award Papers of 2010 URSI Asia-Pacific Radio Science Conference, Toyama, Japan, Publication Year: 2010, paper Y0010.

“Design and Modeling for Chip-to-Chip Communication at 20 Gbps” 
Jianmin Zhang, Qinghua B. Chen, Kelvin Qiu, Antonio C. Scogna, Martin Schauer, Gerardo Romo, James L. Drewniak, Antonio Orlandi
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711320 
Publication Year: 2010, Page(s): 467 - 472

“DC Blocking Via Structure Optimization and Measurement Correlation for SerDes Channels”
Jianmin Zhang, Qinghua B. Chen, Jun Fan, James L. Drewniak, Antonio Orlandi, Bruce Archambeault; Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711337 
Publication Year: 2010, Page(s): 557 - 562

“Stressed Jitter Analysis for Physical Link Characterization” 
Nitin Radhakrishnan, Brice Achkir, Jun Fan, James L. Drewniak;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711339 
Publication Year: 2010, Page(s): 568 - 572

“Surface Impedance Approach to Calculate Loss in Rough Conductor Coated with Dielectric Layer” 
Marina Koledintseva, Amendra Koul, Fan Zhou, James Drewniak, and Scott Hinaga;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711380 
Publication Year: 2010, Page(s): 790 - 795

“Predicting of Wideband Electromagnetic Responses of Composites Containing Magnetic Inclusions” 
Konstantin N. Rozanov, Marina Y. Koledintseva, and James Drewniak;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711392 
Publication Year: 2010, Page(s): 857 - 862

“Investigation of Noise Coupling from Switching Power Supply to Signal Nets” 
Songping Wu, Keong Kam, David Pommerenke, Bill Cornelius, Hao Shi, Matthew Herndon, and Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711251 
Publication Year: 2010, Page(s): 79 - 84

“Extracting Physical IC Models Using Near-Field Scanning” 
Zhenwei Yu, Jayong Koo, Jason A Mix, Kevin Slattery, and Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Digital Object Identifier: 10.1109/ISEMC.2010.5711292 
Publication Year: 2010, Page(s): 317 - 320

“Improvements in GMI Probe Design for Time-Domain Transient Current Measurements” 
Fan Zhou, Songping Wu, David Pommerenke,Yoshiki Kayano, Hiroshi Inoue, Kenji Tan, and Jun Fan; Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711297 
Publication Year: 2010, Page(s): 340 - 343

“Hybrid Method Used to Model Via Transitions” 
Hanfeng Wang, Albert E. Ruehli, Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711308 
Publication Year: 2010, Page(s): 401 - 406

“Improved Target Impedance and IC Transient Current Measurement for Power Distribution Network Design” 
Jingook Kim, Songping Wu, Hanfeng Wang, Yuzou Takita,Hayato Takeuchi, Kenji Araki, Gang Feng, and, Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711316 
Publication Year: 2010, Page(s): 445 - 450

“Analyzing Via Impedance Variations with a Stochastic Collation Method” 
Jianxiang Shen, Hanfeng Wang, Ji Chen, and Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711336 
Publication Year: 2010, Page(s): 552 - 556

“Equivalent Transmission-Line Model for Vias Connected to Striplines in Multilayer Print Circuit Boards” 
Siming Pan, Jianmin Zhang, Qinghua B. Chen, and, Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711318 
Publication Year: 2010, Page(s): 455 - 460 

“Enabling Terabit Per Second Switch Linecard Design Through Chip/Package/PCB Co-design” 
Qinghua Bill Chen, Jianmin Zhang, Kelvin Qiu, Darja Padilla, Zhiping Yang Yang, Antonio C. Scogna, Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711342 
Publication Year: 2010, Page(s): 585 - 590 

“An Equivalent Three-Dipole Model for IC Radiated Emissions Based on TEM Cell Measurements” 
Siming Pan, Jingook Kim, Sungnam Kim, Jaesu Park, Heoncheol Oh, and, Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711354 
Publication Year: 2010, Page(s): 652 - 656 

“Applying Feature Selective Validation (FSV) as an Objective Function for Data Optimization” 
Siming Pan, Hanfeng Wang and Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711366 
Publication Year: 2010, Page(s): 718 - 721 

“Modeling Connector Contact Condition Using a Contact Failure Model with Equivalent Inductance” 
Yu-ichi Hayashi, Songping Wu, Jun Fan, Takaaki Mizuki, Hideaki Sone;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711371 
Publication Year: 2010, Page(s): 743 - 747

“Equivalent Circuit Models for Evaluation of Bandgap Limits for Planar Electromagnetic Bandgap Structures” 
Francesco de Paulis, Leo Raimondo, Antonio Orlandi, Liehui Ren, Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711376 
Publication Year: 2010, Page(s): 770 - 775

“Efficient Mid-Frequency Plane Inductance Computation” 
Fan Zhou, Albert E. Ruehli, Jun Fan;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711387 
Publication Year: 2010, Page(s): 831 - 836 

“Reduction of Noise in Near-Field Measurements” 
Christopher Osterwise, Steven L. Grant, and Daryl Beetner;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711266 
Publication Year: 2010, Page(s): 171 - 176

“Modeling of the Immunity of ICs to EFTs” 
Ji Zhang, Jayong Koo, Daryl G Beetner, Richard Moseley, Scott Herrin and David Pommerenke; Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711323 
Publication Year: 2010, Page(s): 484 - 489

“Rapid Simulation of the Statistical Variation of Crosstalk in Cable Harness Bundles” 
Xiang Li, Meilin Wu, Daryl Beetner, Todd Hubing;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711347 
Publication Year: 2010, Page(s): 614 - 619

“A Lumped-Element Circuit Model of Ferrite Chokes” 
Andrea Orlando, Marina Y. Koledintseva, Daryl G. Beetner, Peng Shao, and Phil Berger; Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711373 
Publication Year: 2010, Page(s): 754 - 759 

“Field Injection Probes for Field Coupled Electrostatic Discharge Sensitivity Database of ICs” 
Zhen Li, Jiang Xiao, Byongsu Seol, Jongsung Lee, David Pommerenke;
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711295 
Publication Year: 2010, Page(s): 329 - 333 

“PCB Design” 
D. Beetner; Fundamentals Tutorial for the IEEE EMC Symposium, 2010, Invited Speaker.

“Real-Time Detection of Radio Receivers Using Stimulated Emissions” 
C. Stagner, C. Osterwise, D. Beetner, S. Grant;
ALERT RICC 2010, NorthEastern University, Boston, MA, 2010. (Unrefereed paper)

“Detection of electronic explosive initiators using their unintended electromagnetic emissions” 
D. Beetner;
ALERT RICC 2010, NorthEastern University, Boston MA, 2010, Invited Speaker.

“Improving electromagnetic compatibility performance of packages and SiP modules using a conformal shielding solution” 
Karim, N.; Jingkun Mao; Jun Fan
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on 
Digital Object Identifier: 10.1109/APEMC.2010.5475724 
Publication Year: 2010, Page(s): 56 - 59

“Recent development of via models: Hybrid circuit and field analysis” 
Yao-Jiang Zhang; Jun Fan;
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE 
Digital Object Identifier: 10.1109/EDAPS.2010.5683001 
Publication Year: 2010, Page(s): 1 - 4 

“A new mixing rule for predicting of frequency-dependent material parameters of composites” 
Rozanov, K.N.; Koledintseva, M.Y.; Drewniak, J.L.
Electromagnetic Theory (EMTS), 2010 URSI International Symposium on 
Digital Object Identifier: 10.1109/URSI-EMTS.2010.5637159 
Publication Year: 2010, Page(s): 584 - 587 

“Physics-based via model development and verification” 
Jianmin Zhang; Chen, Q.B.; Zhiping Yang; Drewniak, J.L.; Orlandi, A.,
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on 
Digital Object Identifier: 10.1109/APEMC.2010.5475507 
Publication Year: 2010, Page(s): 1043 - 1046

“Model for ESD LCD upset of a portable product” 
Jiang Xiao; Pommerenke, D.; Fan Zhou; Drewniak, J.L.; Shumiya, H.; Yamada, T.; Araki, K.
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on 
Digital Object Identifier: 10.1109/ISEMC.2010.5711300 
Publication Year: 2010, Page(s): 354 - 358

“Stub length prediction for back-drilled vias using a fast via tool” 
Jianmin Zhang; Chen, Q.B.; Hanfeng Wang; Jun Fan; Orlandi, A.; Drewniak, J.L.
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE 
Digital Object Identifier: 10.1109/EDAPS.2010.5683010 
Publication Year: 2010, Page(s): 1 - 4

“Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions” 
Jun Fan; Xiaoning Ye; Jingook Kim; Archambeault, B.; Orlandi, A.
Electromagnetic Compatibility, IEEE Transactions on 
Volume: 52, Issue: 2
Digital Object Identifier: 10.1109/TEMC.2010.2045381 
Publication Year: 2010, Page(s): 392 - 400

“Analysis of Simultaneous Switching Noise Coupling in Multilayer Power/Ground Planes With Segmentation Method and Cavity Model” 
Gang Feng; Jun Fan
Electromagnetic Compatibility, IEEE Transactions on 
Volume: 52, Issue: 3
Digital Object Identifier: 10.1109/TEMC.2010.2046665 
Publication Year: 2010, Page(s): 699 - 711

“Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design” 
Jingook Kim; Liehui Ren; Jun Fan
Microwave Theory and Techniques, IEEE Transactions on 
Volume: 58, Issue: 9
Digital Object Identifier: 10.1109/TMTT.2010.2058278 
Publication Year: 2010, Page(s): 2434 - 2447

“Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects” 
Er-Ping Li; Xing-Chang Wei; Cangellaris, A.C.; En-Xiao Liu; Yao-Jiang Zhang; D''Amore, M.; Joungho Kim; Sudo, T.
Electromagnetic Compatibility, IEEE Transactions on 
Volume: 52, Issue: 2
Digital Object Identifier: 10.1109/TEMC.2010.2048755 
Publication Year: 2010, Page(s): 248 - 265