Technical Papers 2013

Electromagnetic Radiation Resulting From PCB/High-Density Connector Interfaces
Archambeault, B.; Connor, S.; Halligan, M.S.; Drewniak, J.L.; Ruehli, A.E.
Electromagnetic Compatibility, IEEE Transactions on
Volume: 55 , Issue: 4
DOI: 10.1109/TEMC.2013.2261736
Publication Year: 2013 , Page(s): 614 – 623

Estimating the radiated emissions from cables attached to a switching power supply in a MIL-STD 461 test
Guang-Hua Li; Wei Qian; Radchenko, A.; Hess, G.; Hoeckele, R.; Jalbert, P.; Van Doren, T.; Pommerenke, D.; Beetner, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670487
Publication Year: 2013 , Page(s): 626 – 631

Locating Noncooperative Radio Receivers Using Wideband Stimulated Emissions
Stagner, C.; Halligan, M.; Osterwise, C.; Beetner, D.G.; Grant, S.L.
Instrumentation and Measurement, IEEE Transactions on
Volume: 62 , Issue: 3
DOI: 10.1109/TIM.2012.2219141
Publication Year: 2013 , Page(s): 667 – 674

Modeling timing variations in digital logic circuits due to electrical fast transients
Xu Gao; Chunchun Sui; Beetner, D.; Hemmady, S.; Rivera, J.; Yakura, S.; Villafuerte, J.; Pommerneke, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670461
Publication Year: 2013 , Page(s): 484 – 488

Major error and sensitivity analysis for characterization of laminate dielectrics on PCB striplines
Rakov, A.; Koledintseva, M.; Drewniak, J.; Hinaga, S.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670529
Publication Year: 2013 , Page(s): 852 – 857

Sheet absorbing material modeling and application for enclosures
Radchenko, A.; Bishop, J.; Johnson, R.; Dixon, P.; Koledintseva, M.; Jobava, R.; Pommerenke, D.; Drewniak, J.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670491
Publication Year: 2013 , Page(s): 645 – 650

SE measurements with a TEM cell to study gasket reliability
Faraji, P.; Drewniak, J.L.; McBain, D.S.; Pommerenke, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670457
Publication Year: 2013 , Page(s): 462 – 465

Efficient complex broadside coupled trace modeling and estimation of crosstalk impact using statistical BER analysis for high volume, high performance printed circuit board designs
Chada, A.R.; Songping Wu; Jun Fan; Drewniak, J.L.; Mutnury, B.; de Araujo, D.N.
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
DOI: 10.1109/ECTC.2013.6575869
Publication Year: 2013 , Page(s): 2095 - 2101

The application of spark gaps on audio jack for ESD protection
Jing Li; Jun Fan; Pommerenke, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670517
Publication Year: 2013 , Page(s): 787 – 791

An Effective Method of Probe Calibration in Phase-Resolved Near-Field Scanning for EMI Application
Ji Zhang; Kam, K.W.; Jin Min; Khilkevich, V.V.; Pommerenke, D.; Jun Fan
Instrumentation and Measurement, IEEE Transactions on
Volume: 62 , Issue: 3
DOI: 10.1109/TIM.2012.2218678
Publication Year: 2013 , Page(s): 648 - 658

A systematic method for determining soft-failure robustness of a subsystem
Maheshwari, P.; Orr, B.; Gossner, H.; Pommerenke, D.; Stadler, W.
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2013 35th
Publication Year: 2013 , Page(s): 1 – 8

Estimating the radiated emissions from cables attached to a switching power supply in a MIL-STD 461 test
Guang-Hua Li; Wei Qian; Radchenko, A.; Hess, G.; Hoeckele, R.; Jalbert, P.; Van Doren, T.; Pommerenke, D.; Beetner, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670487
Publication Year: 2013 , Page(s): 626 – 631

Absolute humidity, relative humidity: which is more important in representing severity of electrostatic discharge
Wan, F.; Ge, J.-X.; Pommerenke, D.
Electronics Letters
Volume: 49 , Issue: 23
DOI: 10.1049/el.2013.1766
Publication Year: 2013 , Page(s): 1451 – 1452

Powered system-level conductive TLP probing method for ESD/EMI hard fail and soft fail threshold evaluation
Schwingshackl, T.; Orr, B.; Willemen, J.; Simburger, W.; Gossner, H.; Bosch, W.; Pommerenke, D.
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2013 35th
Publication Year: 2013 , Page(s): 1 – 8

EM radiation estimation using an automatic probe position recording system coupled to hand scanning
Hui He; Maheshwari, P.; Radchenko, A.; Pommerenke, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670436
Publication Year: 2013 , Page(s): 348 – 353

Effect of spark gap shape on time lag
Wan, F.; Pommerenke, D.; Shumiya, H.; Araki, K.
Electronics Letters
Volume: 49 , Issue: 13
DOI: 10.1049/el.2013.1453
Publication Year: 2013 , Page(s): 795 – 796

A Magnetic-Field Resonant Probe With Enhanced Sensitivity for RF Interference Applications
Hao-Hsiang Chuang; Guang-Hua Li; Eakhwan Song; Hyun-Ho Park; Hyun-Tae Jang; Hark-Byeong Park; Yao-Jiang Zhang; Pommerenke, D.; Tzong-Lin Wu; Jun Fan
Electromagnetic Compatibility, IEEE Transactions on
Volume: 55 , Issue: 6
DOI: 10.1109/TEMC.2013.2248011
Publication Year: 2013 , Page(s): 991 – 998

Sheet absorbing material modeling and application for enclosures
Radchenko, A.; Bishop, J.; Johnson, R.; Dixon, P.; Koledintseva, M.; Jobava, R.; Pommerenke, D.; Drewniak, J.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670491
Publication Year: 2013 , Page(s): 645 – 650

Effect of cooling on the probe system sensitivity for low signal strength RFI problems
Guang-Hua Li; Wei Huang; Pommerenke, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670396
Publication Year: 2013 , Page(s): 134 – 137

SE measurements with a TEM cell to study gasket reliability
Faraji, P.; Drewniak, J.L.; McBain, D.S.; Pommerenke, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670457
Publication Year: 2013 , Page(s): 462 – 465

Investigation of interference in a mobile phone from a DC-to-DC converter
Shinde, S.; Radchenko, A.; Jingnan Pan; Kang Sung-Hee; Dongjin Kim; Sangyeob Lee; Jun Fan; Pommerenke, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670485
Publication Year: 2013 , Page(s): 616 – 620

Heat-Sink Modeling and Design With Dipole Moments Representing IC Excitation
Zhenwei Yu; Mix, J.A.; Sajuyigbe, S.; Slattery, K.P.; Pommerenke, D.; Jun Fan
Electromagnetic Compatibility, IEEE Transactions on
Volume: 55 , Issue: 1
DOI: 10.1109/TEMC.2012.2210720
Publication Year: 2013 , Page(s): 168 – 174

Fair and energy-efficient cooperative relaying with selfish nodes
Jun Fan; Zhengguo Sheng; Liu, C.H.; Vasilakos, A.V.; Xiumei Fan
Communications (ICC), 2013 IEEE International Conference on
DOI: 10.1109/ICC.2013.6655222
Publication Year: 2013 , Page(s): 4202 – 4206

Study of cross polarization of tapered slot antenna for EMC measurements
Fenghan Lin; Jun Fan; Yihong Qi; Yongchang Jiao
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670373
Publication Year: 2013 , Page(s): 12 – 16

An EMD-SVR method for non-stationary time series prediction
Jun Fan; Yanzhen Tang
Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE), 2013 International Conference on
DOI: 10.1109/QR2MSE.2013.6625918
Publication Year: 2013 , Page(s): 1765 – 1770

The application of spark gaps on audio jack for ESD protection
Jing Li; Jun Fan; Pommerenke, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670517
Publication Year: 2013 , Page(s): 787 – 791

An Effective Method of Probe Calibration in Phase-Resolved Near-Field Scanning for EMI Application
Ji Zhang; Kam, K.W.; Jin Min; Khilkevich, V.V.; Pommerenke, D.; Jun Fan
Instrumentation and Measurement, IEEE Transactions on
Volume: 62 , Issue: 3
DOI: 10.1109/TIM.2012.2218678
Publication Year: 2013 , Page(s): 648 - 658

Modeling of Crosstalk Between Two Nonparallel Striplines on Adjacent Layers
Songping Wu; Jun Fan
Electromagnetic Compatibility, IEEE Transactions on
Volume: 55 , Issue: 6
DOI: 10.1109/TEMC.2013.2265275
Publication Year: 2013 , Page(s): 1302 – 1310

Optimization of the transition from connector to PCB board
Shuai Jin; Ji Zhang; Jun Fan
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670407
Publication Year: 2013 , Page(s): 192 – 196

Estimating Radio-Frequency Interference to an Antenna Due to Near-Field Coupling Using Decomposition Method Based on Reciprocity
Hanfeng Wang; Khilkevich, V.; Yao-Jiang Zhang; Jun Fan
Electromagnetic Compatibility, IEEE Transactions on
Volume: 55 , Issue: 6
DOI: 10.1109/TEMC.2013.2248090
Publication Year: 2013 , Page(s): 1125 – 1131

Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance
Hanfeng Wang; Siming Pan; Jingook Kim; Ruehli, A.E.; Jun Fan
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Volume: 3 , Issue: 12
DOI: 10.1109/TCPMT.2013.2272323
Publication Year: 2013 , Page(s): 2134 – 2146

ASIC package to board BGA discontinuity characterization in >10Gbps SerDes links
Lim, J.; Ji Zhang; Wei Yao; Tseng, K.; Qiu, K.; Brooks, R.; Jun Fan
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670477
Publication Year: 2013 , Page(s): 569 - 574

Modeling Local Via Structures Using Innovative PEEC Formulation Based on Cavity Green's Functions With Wave Port Excitation
Hanfeng Wang; Jun Fan
Microwave Theory and Techniques, IEEE Transactions on
Volume: 61 , Issue: 5 , Part: 1
DOI: 10.1109/TMTT.2013.2253791
Publication Year: 2013 , Page(s): 1748 – 1757

Measurement validation of the dipole-moment model for IC radiated emissions
Jingnan Pan; Guanghua Li; Yan Zhou; Yadong Bai; Xuequan Yu; Yaojiang Zhang; Jun Fan
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670495
Publication Year: 2013 , Page(s): 666 – 670

Analytical Transfer Functions Relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer
Chulsoon Hwang; Jingook Kim; Achkir, B.; Jun Fan
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Volume: 3 , Issue: 1
DOI: 10.1109/TCPMT.2012.2226723
Publication Year: 2013 , Page(s): 113 – 125

An Improved Dipole-Moment Model Based on Near-Field Scanning for Characterizing Near-Field Coupling and Far-Field Radiation From an IC
Zhenwei Yu; Mix, J.A.; Sajuyigbe, S.; Slattery, K.P.; Jun Fan
Electromagnetic Compatibility, IEEE Transactions on
Volume: 55 , Issue: 1
DOI: 10.1109/TEMC.2012.2207726
Publication Year: 2013 , Page(s): 97 – 108

Modeling and Application of Multi-Port TSV Networks in 3-D IC
Wei Yao; Siming Pan; Achkir, B.; Jun Fan; Lei He
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Volume: 32 , Issue: 4
DOI: 10.1109/TCAD.2012.2228740
Publication Year: 2013 , Page(s): 487 – 496

Improved Target Impedance for Power Distribution Network Design With Power Traces Based on Rigorous Transient Analysis in a Handheld Device
Jingook Kim; Takita, Y.; Araki, K.; Jun Fan
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Volume: 3 , Issue: 9
DOI: 10.1109/TCPMT.2012.2232353
Publication Year: 2013 , Page(s): 1554 – 1563

A Magnetic-Field Resonant Probe With Enhanced Sensitivity for RF Interference Applications
Hao-Hsiang Chuang; Guang-Hua Li; Eakhwan Song; Hyun-Ho Park; Hyun-Tae Jang; Hark-Byeong Park; Yao-Jiang Zhang; Pommerenke, D.; Tzong-Lin Wu; Jun Fan
Electromagnetic Compatibility, IEEE Transactions on
Volume: 55 , Issue: 6
DOI: 10.1109/TEMC.2013.2248011
Publication Year: 2013 , Page(s): 991 – 998

QoI-Aware Energy-Efficient Participatory Crowdsourcing
Liu, C.H.; Jun Fan; Pan Hui; Crowcroft, J.; Gangyi Ding
Sensors Journal, IEEE
Volume: 13 , Issue: 10
DOI: 10.1109/JSEN.2013.2265936
Publication Year: 2013 , Page(s): 3742 – 3753

Investigation of interference in a mobile phone from a DC-to-DC converter
Shinde, S.; Radchenko, A.; Jingnan Pan; Kang Sung-Hee; Dongjin Kim; Sangyeob Lee; Jun Fan; Pommerenke, D.
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
DOI: 10.1109/ISEMC.2013.6670485
Publication Year: 2013 , Page(s): 616 – 620

Efficient complex broadside coupled trace modeling and estimation of crosstalk impact using statistical BER analysis for high volume, high performance printed circuit board designs
Chada, A.R.; Songping Wu; Jun Fan; Drewniak, J.L.; Mutnury, B.; de Araujo, D.N.
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
DOI: 10.1109/ECTC.2013.6575869
Publication Year: 2013 , Page(s): 2095 – 2101

Heat-Sink Modeling and Design With Dipole Moments Representing IC Excitation
Zhenwei Yu; Mix, J.A.; Sajuyigbe, S.; Slattery, K.P.; Pommerenke, D.; Jun Fan
Electromagnetic Compatibility, IEEE Transactions on
Volume: 55 , Issue: 1
DOI: 10.1109/TEMC.2012.2210720
Publication Year: 2013 , Page(s): 168 – 174