Bo Pu

Visiting assistant research professor

Fields of interests
  • High speed serial and memory interfaces
  • Design of 2.5D system for High Bandwidth Memory and Through Silicon Via for 3D ICs
  • Signal Integrity and Power Integrity Design for High-Speed Printed Circuit Boards and Packages
  • Electromagnetic Immunity Analysis and Enhancement for Integrated Circuits
  • Ph.D. 2015, SungkyunKwan University, Korea
  • MSEE 2011, SungkyunKwan University, Korea
  • BSEE 2009, Harbin Institute of Technology, China