Lijun Jiang

Kummer endowed professor at Missouri S&T

Fields of Interest
  • High Speed Link Design and Optimization
  • Machine Learning for SI/PI/EMC/EMI
  • Fast Methods for Physical Modeling and EDA
  • High Density IC Package Design and 3D Integration
  • TBD
  • D. EE 2004, University of Illinois at Urbana-Champaign, IL, USA
  • MSEE 1996, Tsinghua University, Beijing, China
  • BSEE 1993, Beijing University of Aeronautics and Astronautics, Beijing, China