Thesis

• Estimated Graduation Date: Jun-Aug 2022
• Advisor: Dr. DongHyun (Bill) Kim

Projects at Missouri S&T

• Analysis on Power and Signal Integrity of 2.5D and 3D IC Systems with Through-silicon Vias (TSVs) under Different Bias-voltage and Temperature

Education

• BS 2014, Central South University, China

• MS 2017, Beihang University, China