Wei Zhang

Ph.D. student

  • Estimated Graduation Date: Jun-Aug 2022
  • Advisor: Dr. DongHyun (Bill) Kim
Projects at Missouri S&T
  • Analysis on Power and Signal Integrity of 2.5D and 3D IC Systems with Through-silicon Vias (TSVs) under Different Bias-voltage and Temperature

  • BS 2014, Central South University, China

  • MS 2017, Beihang University, China