Fields of Interest

• High Speed Link Design and Optimization
• Machine Learning for SI/PI/EMC/EMI
• Fast Methods for Physical Modeling and EDA
• High Density IC Package Design and 3D Integration

Courses

• TBD

Education

• D. EE 2004, University of Illinois at Urbana-Champaign, IL, USA
• MSEE 1996, Tsinghua University, Beijing, China
• BSEE 1993, Beijing University of Aeronautics and Astronautics, Beijing, China